for IC chip
ACF(Anisotropic Conductive Films)＜ANISOLM＞
About the product
This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and IC chip.
Applications
Interconnection between LCD and driver IC
Features
- Microscopic bump applicable
- High adhesion and high reliability
- Low contact resistance
- Short bonding time
- For low stress
Characteristics
| Item | Unit | AC-8000 series | |
|---|---|---|---|
| Application | – | for IC chip | |
| Fine pitch capability | Min. contact area | μm2 | 600 |
| Min. space | μm | 10 | |
| Bonding condition |
Temp. | ºC | 140~ |
| Time | sec | 5~ | |
| Pressure | MPa | 40~* | |
※Based on electrode area
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