for Substrate
Die Bonding Paste ＜EPINAL＞
About the product
“EPINAL” has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.
Features
- Excellent workability to eliminate any problems of bonding layer.
- Fast curability for high productivity.
- Low stress for low warpage and high reliability.
Characteristics (Typical Values)
| Items | Unit | EN-4900 | EN-4900F-1 | EN-4900GC | Test method | |
|---|---|---|---|---|---|---|
| Features | – | Low warpage Large chip |
Low modulus Large chip |
Low warpage Small chip |
– | |
| Resin type | – | Acrylate | Acrylate | Acrylate | – | |
| Curing method | – | Heat block | Heat block | Heat block | – | |
| Viscosity | 0.5rpm | Pa∙s | 78 | 100 | 60 | EHD 3ºCone |
| 5.0rpm | Pa∙s | 15 | 20 | 12 | ||
| Die shear strength | 25ºC | N / chip | 37 | 59 | >59 | 2x2mm chip |
| 250ºC | N / chip | 14 | 12 | 17 | ||
| Tensile modulus | MPa | 500 | 350 | 2,800 | Tensilon | |
| Thermal conductivity | W / m∙K | 1.6 | 2.0 | 2.0 | – | |
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