for Lead Frame
Die Bonding Paste ＜EPINAL＞
About the product
“EPINAL” has been used as a die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.
Features
- Excellent workability to eliminate any problems of bonding layer.
- Fast curability for high productivity.
- Low stress for low warpage and high reliability.
- High thermal conductivity.
Characteristics (Typical Values)
| Items | Unit | EN-4270K2 | EN-4600B | EN-4900F-1 | EN-4900GC | EN-4620K | Test method | |
|---|---|---|---|---|---|---|---|---|
| Features | – | High modulus Small chip |
Low warpage Cu L/F |
Low modulus Large chip |
Low warpage PPF |
High thermal conductive |
– | |
| Resin type | – | Epoxy | Epoxy | Acrylate | Acrylate | Epoxy | – | |
| Curing method | – | Heat block | Oven | Heat block | Heat block | Oven | – | |
| Viscosity | 0.5rpm | Pa∙s | 70 | 56 | 100 | 60 | 113 | EHD 3ºCone |
| 5.0rpm | Pa∙s | 11 | 11 | 20 | 12 | 20 | ||
| Die shear strength | 25ºC | N / chip | >59 | >59 | 59 | >59 | 45 | 2x2mm chip |
| 250ºC | N / chip | 16 | 11 | 12 | 17 | 27 | ||
| Tensile modulus | MPa | 4,900 | 3,500 | 350 | 2,800 | 4,800 | Tensilon | |
| Thermal conductivity | W / m∙K | 0.8 | 1.5 | 2.0 | 2.0 | 10 | – | |
※2×2 Si chip
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