AS-400HS/MCF-400HS
Low Loss Adhesive Film
Product form
| Adhesive Film | AS-400HS |
| Resin Coated Copper | MCF-400HS |
Applications
- Antena use
- High-Speed PCB
Features
- Excellent dielectric properties (Low transmission loss)
- Adaptable to multi layer press process.
- Good adhesion to PTFE
- Adaptable to interlaminate connection by laser IVH
Characteristics
Transmission Loss
Measurement Conditions
- Transmission structure: Micro-strip-line
- Temperature & Humidity: 25℃/40%RH
- Characteristic impedance: 50Ω
- Calibration method: TRL
- Line width(w): 240–270 µm
- Dielectric thickness(b): 100–130 µm
- Copper thickness (t): 30 µm (include plating)
Cross section of laser-via
C-stage
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| AS-400HS/MCF-400HS | ||||||
| Storage Modulus (DMA method: 25℃) | A | Gpa | 3–5 | – | ||
| Tg (DMA method) | A | ℃ | 190–250 | – | ||
| CTE ※1 | Z | ＜Tg | A | ppm/℃ | 20–45 | 2.4.24 |
| ＞Tg | A | 35–75 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | – | ||
| Copper Peel Strength | 18 µm HVLP | A | kN/m | 0.45–0.60 | 2.4.8 | |
| Dielectric Constant | 10GHz ※2 | A | – | 2.9–3.1 | IEC-62810 | |
| Dissipation Factor | 10GHz ※2 | A | – | 0.0020–0.0030 | ||
※1 Heating Rate: 10℃/min. (. Compression)
※2 Mesured by cavity resonator.
※ Refer to“Condition Note”
B-stage
| Item | Conditon | Unit | Actual Value | Reference |
|---|---|---|---|---|
| Volatile Content | 180℃ 5min. weight method | wt% | <2 | – |
Standard Specifications
| Part Number | Actual Thickness | Carrier Film Thickness |
|---|---|---|
| AS-400HS | 25 µm, 50 µm, 65 µm | 50 µm (PET) |
| MCF-400HS | 25 µm, 50 µm, 65 µm | 12 µm, 18 µm (HVLP foil) |
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