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Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules

by Kyogo Komiyama | Mar 23, 2023 | R&D

23 March 2023 Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) is set to launch full-scale operation of Power Module Integration Center (“PMiC”), which is located at Oyama Plant in Tochigi Prefecture, to enhance development activity of materials for...

Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base

by Kyogo Komiyama | Mar 13, 2023 | R&D

13 March 2023 In January 2023, Resonac Corporation (TOKYO: 4004) (President and CEO: Hidehito Takahashi) is launching a project to develop new semiconductor materials for 6G, the next-generation telecommunication system standard following 5G. Resonac will implement...

RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development

by Kyogo Komiyama | Mar 9, 2023 | R&D

09 March 2023 Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) has successfully applied virtual reality (VR) technology*1 to the development of semiconductor materials. This is the first time that the VR technology has been implemented to develop...

Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers

by Kyogo Komiyama | Mar 1, 2023 | Business

01 March 2023 Resonac Corporation (Tokyo: 4004, President: Hidehito Takahashi) has developed a third generation of high-grade silicon carbide (SiC) epitaxial wafer (HGE-3G) for power semiconductors and has started to mass-produce it. HGE-3G has quality superior to...

Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors

by Kyogo Komiyama | Jan 12, 2023 | R&D

12 January 2023 Resonac Corporation (Resonac) (President: Hidehito Takahashi) has concluded new multiyear contracts with Infineon Technologies AG (Infineon), a German semiconductor manufacturer providing power semiconductors worldwide, to continue supplying SiC...
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Recent Posts

  • Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules
  • Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
  • RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
  • Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
  • Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors

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